Integrated Semiconductor Device And Wafer Level Method Of Fabricating The Same

ABSTRACT

The present disclosure provides one embodiment of a stacked semiconductor device. The stacked semiconductor device includes a first substrate; a first bond pad over the first substrate; a second substrate including a second electrical device fabricated thereon; a second bond pad over the second electrical device over the second substrate, the second bond pad electrically connecting to the second electrical device; a second insulation layer over the second bond pad having a top surface, the second insulation layer being bonded toward the first bond pad of the first substrate; and a through-substrate-via (“TSV”) extending from a surface opposite to the first bond pad through the first substrate and through the top surface of the second insulation layer to the second bond pad.

PRIORITY

This application is a divisional application of U.S. patent applicationSer. No. 14/551,874, filed Nov. 24, 2014, which is a divisionalapplication of U.S. patent application Ser. No. 13/773,224, filed Feb.21, 2013, issued as U.S. Pat. No. 8,895,360, which claims priority toU.S. Patent Application No. 61/677,902 filed Jul. 31, 2012, entitled“INTEGRATED PASSIVE AND CMOS DEVICE AND WAFER LEVEL METHOD OFFABRICATING THE SAME,” each of which is incorporated herein by referencein its entirety.

BACKGROUND

Passive electrical devices, such as capacitors or inductors, aresometimes integrated with complementary metal-oxide-semiconductor(“CMOS”) chips. Traditionally, when large capacitances or inductancesare required, the use of large size passive devices is necessary. As aresult, interconnecting such devices is only possible through externalelectrical paths, such as wire bonding. Moreover, when working withlarger chip sizes, longer electrical paths are necessary.

Traditional passive device/CMOS integration presents a number ofdisadvantages. First, electrical parasitics created by longer electricalpaths can deteriorate chip performance, especially after molding.Second, it is difficult to shrink the size of the system due to the padsrequired to wirebond the passive devices to the CMOS chip. Third,because the passive devices must be individually bonded to the CMOSchip, precision is decreased which further increases difficulty ofsystem shrinkage. Fourth, precise assembly of multiple passive deviceswith a CMOS chip takes effort, which increases fabrication costs.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read in conjunction with the accompanying figures. Itis emphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale and are used forillustration purposes only. In fact, the dimensions of the variousfeatures may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a flow chart of a method for fabricating a device according toan exemplary embodiment of the present invention;

FIGS. 2A-2D are diagrammatic cross-sectional views of a device duringvarious steps of the method of FIG. 1, according to an exemplaryembodiment of the present invention; and

FIGS. 3A-3D are diagrammatic cross-sectional views of an alternativedevice during various steps of the method of FIG. 1, according toanother exemplary embodiment of the present invention.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, descriptions of a firstfeature “on” or “over” a second feature (and like descriptions) mayinclude embodiments where the first and second features are in directcontact, and may also include embodiments where additional features areinterposed between the first and second features. In addition, thepresent disclosure may repeat reference numerals and/or letters in thevarious examples. This repetition is for the purpose of simplicity andclarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed. Further, spatiallyrelative terms, such as “beneath,” “below,” “lower,” “above,” “upper”and the like, may be used herein for ease of description to describe oneelement or feature's relationship to another element(s) or feature(s) asillustrated in the figures. The spatially relative terms are intended toencompass different orientations of the device in use or operation inaddition to the orientation depicted in the figures. For example, if thedevice in the figures is turned over, elements described as being“below” or “beneath” other elements or features would then be oriented“above” the other elements or features. Thus, the exemplary term “below”can encompass both an orientation of above and below. The apparatus maybe otherwise oriented (rotated 90 degrees or at other orientations) andthe spatially relative descriptors used herein may likewise beinterpreted accordingly.

FIG. 1 is a flow chart illustrating steps in a wafer level method 10 forfabricating a device according to an exemplary embodiment of the presentinvention. The method 10 fabricates a stacked semiconductor device suchas, for example, a complementary metal-oxide-semiconductor (“CMOS”)device. At step 12, a first substrate is provided that includes one ormore first electrical devices fabricated on a substrate. In the presentembodiment, the substrate is a bulk silicon substrate. As would beunderstood by one ordinarily skilled in the art having the benefit ofthis disclosure, the substrate could be, for example, silicon orceramic, and the electrical device(s) could be passive (e.g., capacitor,inductor, resistor, etc.) or active devices. The electrical devices maybe fabricated on the substrate using a variety of micro-fabricationtechnologies, such as, for example, lithography, etching or filmdeposition. Moreover, in an alternative embodiment, there are no activedevices present in the device substrate. However, in the alternative,the device substrate may include active devices, such as, for example, adiode or transistor.

At step 14, one or more bond pads are formed over the first substrate.At step 16, a second substrate having a second electrical device (e.g.,a CMOS device) is provided. In the present embodiment, the secondsubstrate is also a bulk silicon substrate, although other substratescan be used, as discussed above with reference to the first substrate.At step 18, one or more bond pads are formed over the second substrate.At step 20, the first and second substrates are then aligned and bondedto one another, thus reducing assembly effort. In this exemplaryembodiment, the device substrate (i.e., first substrate) and CMOS devicewafer (i.e., second substrate) are precisely aligned at <10 um, thusproviding controllability of electrical parasitics that can result fromchip interconnections. Also, in this exemplary embodiment, wafer bondingmethods are conductive wafer bonding method such as, for example, fusionbonds, eutectic bonds, and/or hybrid bonds may be utilized to bond thesubstrate to the CMOS device. In another embodiment, the bonding methodsinclude non-conductive wafer bonding. In furtherance of the embodiments,the bonding method in FIG. 2D uses a conductive wafer bonding and thebonding method in FIG. 3D may use a non-conductive wafer bonding oralternatively a conductive wafer bonding. However, those ordinarilyskilled in the art having the benefit of this disclosure realize thereare a variety of other bonding methods which could be utilized.

Thereafter, at step 22, one or more through-substrate-vias (“TSVs”) areformed to connect the first and second electrical devices. Thus, asdescribed herein, conductive wafer bonding and/or TSVs are utilized tointerconnect the first and second device substrates. In embodimentsutilizing the conductive wafer interface as the interconnect, Ge/Al,Al/Al, Cu/Cu or other bonding materials may be utilized. Moreover, theTSVs may be utilized to provide both internal and external connectionsfor the chip.

FIGS. 2A-2D provide diagrammatic cross-sectional views of a device 100,in portion or entirety, at various stages of fabrication according tothe exemplary wafer level method 10 of FIG. 1. Device 100 may include anintegrated circuit device, specifically a CMOS device, integrated with asubstrate having one or more passive devices disposed therein. Thepassive device(s) utilized in this embodiment are trench capacitors.However, those ordinarily skilled in the art having the benefit of thisdisclosure realize any variety or combination of other passive devicessuch as, for example, inductors or resistors, may be disposed thereinalso. In this exemplary embodiment, the CMOS and passive device(s) areinterconnected using a conductive wafer bonding interface. FIGS. 2A-2Dhave been simplified for the sake of clarity to better understand theinventive concepts of the present disclosure. Additional features can beadded in the device 100, and some of the features described below can bereplaced or eliminated for additional embodiments of the device 100.

Referring to FIG. 2A, device 100 includes a device substrate 110. Inthis exemplary embodiment, device substrate 110 includes a substrate 111having a plurality of trench capacitors 112 designed and formed thereinutilizing any suitable fabrication process. Substrate 111 is asemiconductor substrate, such as a silicon or ceramic substrate.Alternatively or additionally, the semiconductor substrate includes anelementary semiconductor including germanium; a compound semiconductorincluding silicon carbide, gallium arsenic, gallium phosphide, indiumphosphide, indium arsenide, and/or indium antimonide; an alloysemiconductor including SiGe, GaAsP, AlInAs, AlGaAs, GaInAs, GaInP,and/or GaInAsP, or combinations thereof. Furthermore, substrate 110 mayalso be a semiconductor on insulator (SOI).

In the depicted embodiment, the substrate 111 may further includevarious layers that are not separately depicted and that combine to formvarious microelectronic elements that may include: transistors (forexample, metal-oxide-semiconductor field-effect transistors (MOSFETs)including CMOS transistors, bipolar junction transistors (BJTs), highvoltage transistors, high frequency transistors, p-channel and/orn-channel field-effect transistors (PFETs/NFETs), resistors, diodes,capacitors, inductors, fuses, other suitable elements, or combinationsthereof. The various layers may include high-k dielectric layers, gatelayers, hard mask layers, interfacial layers, capping layers,diffusion/barrier layers, dielectric layers, conductive layers, othersuitable layers, or combinations thereof. The various layers of thesubstrate 111 may also include various doped regions, isolationfeatures, other features, or combinations thereof. Moreover, suchmicroelectronic elements may interconnect to one another to form aportion of the substrate 110, such as a logic device, memory device (forexample, a static random access memory (SRAM)), radio frequency (RF)device, input/output (I/O) device, system-on-chip (SoC) device, othersuitable type of device, or combinations thereof.

Device substrate 110 includes an insulation layer 114 disposed oversubstrate 111. In this exemplary embodiment, insulation layer 114 ismade of a material such as, for example, silicon oxide. However, thoseordinarily skilled in the art having the benefit of this disclosurerealize a variety of other insulators may be utilized. A plurality ofconductive elements 116 are disposed within insulation layer 114.Conductive elements 116 comprise both horizontal and verticalinterconnects, such as contacts and/or vias, such as conductive lines.Exemplary metals utilized in conductive elements 116 may includealuminum, aluminum/silicon/copper alloy, copper, titanium, titaniumnitride, tantalum, tantalum nitride, tungsten, polysilicon, metalsilicide, or combinations thereof. Conductive elements 116 may be formedby processes including physical vapor deposition (PVD), chemical vapordeposition (CVD), or combinations thereof.

Other manufacturing techniques to form the various conductive elements116 may include photolithography processing and etching to patternconductive materials to form the vertical and horizontal interconnects.Still other manufacturing processes may include thermal annealing toform metal silicide. The metal silicide used in conductive elements 116may include nickel silicide, cobalt silicide, tungsten silicide,tantalum silicide, titanium silicide, platinum silicide, erbiumsilicide, palladium silicide, or combinations thereof. Alternatively,conductive elements 116 may be copper multilayer interconnects, whichinclude copper, copper alloy, titanium, titanium nitride, tantalum,tantalum nitride, tungsten, polysilicon, metal silicide, or combinationsthereof. The copper interconnects may be formed by a process includingPVD, CVD, or combinations thereof. It is understood that conductiveelements 116 are not limited by the number, material, size, and/ordimension of those illustrated, and thus, may include any number,material, size, and/or dimension of conductive features depending ondesign requirements of the device 100.

Referring to FIG. 2B, fabrication of the conductive wafer bond interfacewill now be described. Here, a CMOS metal layer 120 is formed overinsulation 114. CMOS metal layer 120 is another interconnect and, thus,may be fabricated using those same process and materials discussed abovein relation to conductive elements 116. Conductive bonding material 122is disposed above CMOS metal layer 120. As understood in the art, Ge/Al,Al/Al, Cu/Cu or other bonding materials may be utilized as the bondingmaterial. In addition, CMOS metal layer 120 and conducting bondingmaterial 122 jointly form a bond pad.

Referring now to FIG. 2C, at this stage in the fabrication process aCMOS device wafer 124 is bonded to device substrate 110 using conductivewafer bonding. In this exemplary embodiment, wafer bonding methods suchas, for example, fusion bonds, eutectic bonds, and/or hybrid bonds maybe utilized. However, those ordinarily skilled in the art having thebenefit of this disclosure realize there are a variety of other bondingmethods which could be utilized. As illustrated, CMOS device wafer 124includes a CMOS 128 formed on substrate 130 using suitable CMOSprocesses. In order to achieve bonding, another CMOS metal layer 120(i.e., bond pad) is formed on CMOS device wafer 124, whereby CMOS devicewafer 124 and substrate 110 are bonded together. Conductive bondingmaterial may also be applied to CMOS metal layer 120 of wafer 124 (thusalso forming a bond pad), as would be understood by one ordinarilyskilled in the art having the benefit of this disclosure.

CMOS device wafer 124 further includes an insulation layer 126 havingconductive elements 116 disposed therein. In this exemplary embodiment,the insulation layer 126 is an oxide layer, such as silicon oxide.Alternatively or additionally, the insulating layer may include siliconnitride, silicon oxynitride, other suitable material, or combinationsthereof. As previously described, conductive elements 116 includeconductive materials, such as metal. For example, the conductivematerials may include tungsten, titanium, aluminum, copper, alloysthereof, other suitable metals or alloys thereof, or combinationsthereof.

Substrate 130 is a semiconductor substrate, such as a silicon substrate.Alternatively or additionally, the semiconductor substrate includes anelementary semiconductor including germanium; a compound semiconductorincluding silicon carbide, gallium arsenic, gallium phosphide, indiumphosphide, indium arsenide, and/or indium antimonide; an alloysemiconductor including SiGe, GaAsP, AlInAs, AlGaAs, GaInAs, GaInP,and/or GaInAsP; or combinations thereof. Furthermore, substrate 130 mayalso be a semiconductor on insulator (SOI) and may also include variouslayers that are not separately depicted and that combine to form variousmicroelectronic elements that may include: transistors (for example,metal-oxide-semiconductor field-effect transistors (MOSFETs) includingCMOS transistors, bipolar junction transistors (BJTs), high voltagetransistors, high frequency transistors, p-channel and/or n-channelfield-effect transistors (PFETs/NFETs), resistors, diodes, capacitors,inductors, fuses, other suitable elements, or combinations thereof. Thevarious layers may include high-k dielectric layers, gate layers, hardmask layers, interfacial layers, capping layers, diffusion/barrierlayers, dielectric layers, conductive layers, other suitable layers, orcombinations thereof. The various layers of the substrate 130 may alsoinclude various doped regions, isolation features, other features, orcombinations thereof. Moreover, such microelectronic elements mayinterconnect to one another to form a portion of the substrate 130, suchas a logic device, memory device (for example, a static random accessmemory (SRAM)), radio frequency (RF) device, input/output (I/O) device,system-on-chip (SoC) device, other suitable type of device, orcombinations thereof.

Referring to FIG. 2D, the completion of the fabrication of device 100will now be described. As illustrated, after CMOS device wafer 124 isbonded to device substrate 110 using the conductive wafer bondinginterface (i.e., the bonding pads 120,122), a TSV 132 is formed withinsubstrate 111, extending from the bottom of substrate 111 up to thebottom of conductive element 116. As such, TSV 132 provides bothinternal and external electrical connections for device 100. The TSV 132includes an insulation layer 115 formed along sidewalls of TSV 132 andbeneath substrate 111, and may be comprised of the same material as thatof insulation layer 114 previously described. The TSV 132 also includesa metal trace 134 over the insulation layer 115. The metal trace 134 isthen bonded to a solder ball or a conductive bump 136 and extendsunderneath substrate 111 to connect conductive elements 116 to providethe external electrical connection. In at least one embodiment, themetal trace 134 completely fills the hole of the TSV 132 and over aportion of a top surface of the insulation layer 115. In certainembodiments, the metal trace 134 is formed along the sidewalls of TSV132, not completely filling the hole of the TSV 132, and over a portionof a top surface of the insulation layer 115. Thereafter, passivationmaterial 138 is provided underneath substrate 111 and over TSV 132 toprevent corrosion. In this exemplary embodiment, passivation material138 is, for example, an oxide or nitride, or polymers such as, forexample, epoxy, polyimide, parylene, etc. Although only one TSV 132 isillustrated herein, those ordinarily skilled in the art having thebenefit of this disclosure realize multiple TSVs may be utilized.Accordingly, device 100 has been integrated with multiple passivedevices, thereby providing a device to minimize and stabilizeundesirable electrical parasitics at a low assembly cost.

FIGS. 3A-3D are diagrammatic cross-sectional views of another exemplarydevice 200, in portion or entirety, at various stages of fabricationaccording to the method 10 of FIG. 1. The embodiment of FIGS. 3A-3D issimilar in many respects to the embodiment of FIGS. 2A-2D. The mostnotable distinction, however, is that the embodiment of FIGS. 3A-3Dutilizes integration by TSVs instead of integration by conductive waferbonding, as previously described in relation to FIGS. 2A-2D.Nevertheless, the embodiments are similar in that, for example, thedevice 200 also includes a first and second device wafer. Accordingly,similar features in FIGS. 3A-3D are identified by the same referencenumerals for clarity and simplicity. FIGS. 3A-3D have been simplifiedfor the sake of clarity to better understand the inventive concepts ofthe present disclosure. Additional features can be added in the device200, and some of the features described below can be replaced oreliminated in other embodiments of the device 200.

Device 200 includes an integrated circuit device such as, for example, aCMOS device, integrated with a substrate having one or more passive oractive electrical devices disposed therein. The passive device(s)utilized in this embodiment are trench capacitors. However, thoseordinarily skilled in the art having the benefit of this disclosurerealize any variety or combination of active or other passive devicessuch as, for example, inductors or resistors, may be disposed thereinalso. In this exemplary embodiment, the CMOS and passive device(s) areintegrated using one or more TSVs.

Referring to FIG. 3A, device 200 includes a device substrate 110. Inthis exemplary embodiment, device substrate 110 includes a substrate 111having a plurality of trench capacitors 112 designed and formed thereinutilizing any suitable fabrication process. Substrate 111 is asemiconductor substrate, such as a silicon or ceramic substrate.Alternatively or additionally, the semiconductor substrate includes anelementary semiconductor including germanium; a compound semiconductorincluding silicon carbide, gallium arsenic, gallium phosphide, indiumphosphide, indium arsenide, and/or indium antimonide; an alloysemiconductor including SiGe, GaAsP, AlInAs, AlGaAs, GaInAs, GaInP,and/or GaInAsP; or combinations thereof. Furthermore, substrate 110 mayalso be a semiconductor on insulator (SOI).

In the depicted embodiment, the substrate 111 may also include variouslayers that are not separately depicted and that combine to form variousmicroelectronic elements that may include: transistors (for example,MOSFETs including CMOS transistors, BJTs, high voltage transistors, highfrequency transistors, PFETs/NFETs), resistors, diodes, capacitors,inductors, fuses, other suitable elements, or combinations thereof. Thevarious layers may include high-k dielectric layers, gate layers, hardmask layers, interfacial layers, capping layers, diffusion/barrierlayers, dielectric layers, conductive layers, other suitable layers, orcombinations thereof. The various layers of the substrate 111 may alsoinclude various doped regions, isolation features, other features, orcombinations thereof. Moreover, such microelectronic elements mayinterconnect to one another to form a portion of the substrate 110, suchas a logic device, memory device (for example, a SRAM), RF device, I/Odevice, SoC device, other suitable type of device, or combinationsthereof.

Device substrate 110 includes an insulation layer 114 disposed oversubstrate 111. In this exemplary embodiment, insulation layer 114 ismade of a material such as, for example, silicon oxide. However, thoseordinarily skilled in the art having the benefit of this disclosurerealize a variety of other insulators may be utilized. A plurality ofconductive elements 116 are disposed within insulation layer 114.Conductive elements 116 comprise both horizontal and verticalinterconnects, such as contacts and/or vias, such as conductive lines.Exemplary metals utilized in conductive elements 116 may includealuminum, aluminum/silicon/copper alloy, copper, titanium, titaniumnitride, tantalum, tantalum nitride, tungsten, polysilicon, metalsilicide, or combinations thereof. Conductive elements 116 may be formedby processes including physical vapor deposition (PVD), chemical vapordeposition (CVD), or combinations thereof.

Other manufacturing techniques to form the conductive elements 116 mayinclude photolithography processing and etching to pattern conductivematerials to form the vertical and horizontal connects. Still othermanufacturing processes may include thermal annealing to form metalsilicide. The metal silicide used in conductive elements 116 may includenickel silicide, cobalt silicide, tungsten silicide, tantalum silicide,titanium silicide, platinum silicide, erbium silicide, palladiumsilicide, or combinations thereof. Alternatively, conductive elements116 may be copper multilayer interconnects, which include copper, copperalloy, titanium, titanium nitride, tantalum, tantalum nitride, tungsten,polysilicon, metal silicide, or combinations thereof. The copperinterconnects may be formed by a process including PVD, CVD, orcombinations thereof. It is understood that conductive elements 116 arenot limited by the number, material, size, and/or dimension of thoseillustrated, and thus, may include any number, material, size, and/ordimension of conductive features depending on design requirements of thedevice 200.

Referring to FIG. 3B, a recess 140, or opening, is fabricated on theupper surface of insulation layer 114. In this exemplary embodiment, alower surface 142 of the recess 140 extends down to a lower surface 116a of the uppermost conductive elements 116. The recess 140 is formed bya suitable process, such as lithography process and etching.

Referring now to FIG. 3C, at this stage in the fabrication process aCMOS device wafer 124 is integrated with device substrate 110 usingTSVs. As illustrated, CMOS device wafer 124 includes a CMOS 128 formedon a substrate 130 utilizing suitable CMOS processes. In order to allowintegration of CMOS wafer 124 and device substrate 110, another recess140, or opening, is fabricated on the lower surface of insulation layer126 to match those oxide patterns fabricated on device substrate 110.Thus, CMOS device wafer 124 also includes an insulation layer 126 havingconductive elements 116 disposed therein. Also, note that the uppersurface 144 of recess 140 of CMOS wafer 124 exposes the lowermostsurface 116 b of conductive elements 116, thereby exposing conductiveelements 116 to form a bond pad.

In this exemplary embodiment, insulation layer 126 is an oxide layer,such as a silicon oxide layer. Alternatively or additionally, theinsulating layer may include silicon nitride, silicon oxynitride, othersuitable material, or combinations thereof. Conductive elements 116include conductive materials, such as metal, as previously described.For example, the conductive materials may include tungsten, titanium,aluminum, copper, alloys thereof, other suitable metals or alloysthereof, or combinations thereof.

Details of the materials and fabrication methods of the substrate 130can be found in the text associated with the substrate 130 in the device100 and are not repeated here. In this exemplary embodiment, CMOS devicewafer 124 is bonded to device substrate 110 using, for example, fusionbonds, eutectic bonds, and/or hybrid bonds. However, those ordinarilyskilled in the art having the benefit of this disclosure realize thereare a variety of other bonding methods which could be utilized.

Referring to FIG. 3D, the completion of the fabrication of device 200will now be described. As illustrated, after alignment of recesses 140of device substrate 110 and CMOS device wafer 124, CMOS device wafer 124is bonded to device substrate 110, and one or more TSVs 133 are formedwithin substrate 111 in order to provide both internal and externalelectrical connections for device 200. In this exemplary embodiment,TSVs 133 extend from the bottom of substrate 111, though insulationlayer 114, up to bond pad 116 b (e.g., lowermost surface 116 b ofconductive elements 116) of CMOS device wafer 124, while TSVs 133 extendfrom the bottom of substrate 111 up to one or more bond pads 116 a(e.g., lower surface 116 a of the uppermost conductive elements 116) todevice substrate 110.

The TSVs 133 include an insulation layer 115 formed along sidewalls ofTSVs 133 and beneath substrate 111, and may be comprised of the samematerial as that of insulation layer 114 previously described. The TSVs133 also include a metal trace 134 formed over insulation layer 115. Themetal trace 134 extends underneath substrate 111 to connect conductiveelements 116 in CMOS device wafer 124 and is bonded to a solder ball ora conductive bump 136 to provide external electrical connection. Metaltrace 134 may be formed using, for example, a seed layer deposition orcopper plating process. In at least one embodiment, the metal trace 134completely fills the hole of the TSV 133 and over a portion of a topsurface of the insulation layer 115. In certain embodiments, the metaltrace 134 is formed along the sidewalls of TSV 133, not completelyfilling the hole of the TSV 133, and over a portion of a top surface ofthe insulation layer 115. Thereafter, passivation material 138 isprovided underneath substrate 111 and along TSVs 133 to preventcorrosion. In this exemplary embodiment, passivation material 138 maybe, for example, an oxide or nitride, or polymers, such as, for example,epoxy, polyimide, parylene, etc. Although multiple TSVs are illustratedherein, those ordinarily skilled in the art having the benefit of thisdisclosure realize that a single TSV may also be utilized. Accordingly,device 200 has been integrated with multiple passive devices, therebyproviding a device to minimize and stabilize undesirable electricalparasitics at a low assembly cost.

Exemplary embodiments of the present invention may be integrated with avariety of bonding techniques. For example, in an exemplary methodologyof the present invention, a die to wafer bonding technique may beutilized in which a plurality of semiconductor dies are fabricated, andthen bonded to a single wafer having a plurality of circuits fabricatedthereon. Another exemplary methodology utilizes a wafer to wafer bondingtechnique, in which a plurality of circuits are fabricated on a firstand second substrate, and then bonded to one another as describedherein. In addition, after bonding, the stacked devices may undergowafer level packaging and dicing as desired. Accordingly, thoseordinarily skilled in the art having the benefit of this disclosurerealize there are a variety of such techniques which may be integratedinto the present invention.

The present disclosure thus provides a device that integrates one ormore electrical devices with a CMOS device to minimize and stabilizeelectrical parasitics and provide for a more compact system integration,all at a lower cost than traditional integration techniques. Asdescribed herein, the electrical device(s) are made on a devicesubstrate that is aligned with and bonded to another device substrate,which reduces assembly effort. Due to the precise alignment of the firstand second substrates (for example, <10 um), electrical parasiticsresulting from interconnections can be well controlled. Since noadditional wire bond paths are necessary, the present disclosure furtherprovides more compact system integration.

Moreover, in the exemplary embodiments described herein, the devicesubstrates include one or more passive devices on the same wafer.However, this should not be interpreted as limiting the disclosed devicesubstrates to such embodiments. For example, active devices may also beutilized. Also, it is contemplated that the disclosed device substratesmay comprise multiple device substrates on multiple wafers stacked atopone another. Moreover, the interconnection between the device substratesmay be a conductive wafer bonding interface and/or one or more TSVs.

Furthermore, the present disclosure also provides for many otherembodiments of the integrated device. Different embodiments may havedifferent advantages, and no particular advantage, such as thosedescribed above, is necessarily required of any embodiment. For example,the present invention is not to be limited to TSVs, but may alsoencompass other vertical electrical connections passing through a die.Also, more than one CMOS device may be integrated into the devicesdescribed herein.

In an exemplary embodiment, a method to fabricate a stackedsemiconductor device comprises providing a first substrate having afirst electrical device fabricated thereon, providing a first bond padon the first substrate, providing a second substrate having a secondelectrical device fabricated thereon, providing a second bond pad on thesecond substrate, bonding the first and second substrates together, andproviding a through-substrate-via (“TSV”) through the first substrate tointerconnect the first and second electrical devices, thus electricallycoupling the stacked semiconductor device.

In an alternative embodiment, providing the first substrate furthercomprises providing a plurality of discrete circuits on the firstsubstrate and providing a first bond pad on each of the plurality ofdiscrete circuits on the first substrate, wherein providing the secondsubstrate further comprises providing a plurality semiconductor dies asthe second substrate, each of the plurality of semiconductor dies havingan electrical device fabricated thereon and providing a second bond padon each of the plurality of semiconductor dies, wherein bonding thefirst and second substrates further comprises bonding each of theplurality of semiconductor dies to a corresponding discrete circuit ofthe first substrate through the first and second bond pads.

In yet another alternate embodiment, providing the first substratefurther comprises providing a plurality of discrete circuits on thefirst substrate and providing a first bond pad on each of the pluralityof discrete circuits on the first substrate, wherein providing thesecond substrate further comprises providing a plurality of discretecircuits on the second substrate and providing a second bond pad on eachof the plurality of discrete circuits on the second substrate, whereinbonding the first and second substrates further comprises bonding eachof the discrete circuits of the first substrate to a correspondingdiscrete circuit of the second substrate through the first and secondbond pads.

In another alternative embodiment, providing the first substrate furthercomprises providing a plurality of discrete circuits on the firstsubstrate, providing a first bond pad on each of the plurality ofdiscrete circuits on the first substrate, providing a first insulationlayer over the first bond pad and providing a first opening on the firstinsulation layer, wherein providing the second substrate furthercomprises providing a plurality semiconductor dies as the secondsubstrate, each of the plurality of semiconductor dies having anelectrical device fabricated thereon, providing a second bond pad oneach of the plurality of semiconductor dies, providing a secondinsulation layer over the second bond pad and providing a second openingon the second insulation layer, wherein bonding the first and secondsubstrates further comprises extending the TSV through the firstsubstrate to electrically couple to the second bond pad.

In yet another alternative embodiment, providing the first substratefurther comprises providing a plurality of discrete circuits on thefirst substrate, providing a first bond pad on each of the plurality ofdiscrete circuits on the first substrate, providing a first insulationlayer over the first bond pad and providing a first opening on the firstinsulation layer, wherein providing the second substrate furthercomprises providing a plurality of discrete circuits on the secondsubstrate, providing a second bond pad on each of the plurality ofdiscrete circuits on the second substrate, providing a second insulationlayer over the second bond pad and providing a second opening on thesecond insulation layer, wherein bonding the first and second substratesfurther comprises extending the TSV through the first substrate toelectrically couple to the second bond pad.

In another exemplary embodiment, a method is provided that comprisesintegrating a stacked semiconductor device into an electrical system,the device comprising a first substrate having a first electrical devicefabricated thereon, a first bond pad on the first substrate, a secondsubstrate having a second electrical device fabricated thereon, a secondbond pad on the second substrate, wherein the first and secondsubstrates are bonded together, and a through-substrate-via (“TSV”)extending through the first substrate to interconnect the first andsecond substrates, thus electrically coupling the stacked semiconductordevice.

Yet another exemplary embodiment of the present invention provides astacked semiconductor device comprising a first substrate having a firstelectrical device fabricated thereon, a first bond pad on the firstsubstrate, a second substrate having a second electrical devicefabricated thereon, a second bond pad on the second substrate, whereinthe first and second substrates are bonded together, and athrough-substrate-via (“TSV”) extending through the first substrate tointerconnect the first and second substrates, thus electrically couplingthe stacked semiconductor device.

In another exemplary embodiment, a stacked semiconductor device includesa first substrate having one or more passive electrical devicesfabricated thereon, with no active devices fabricated thereon. Examplepassive electrical devices include capacitors, coils, resistors, andinductors. The device also includes a second substrate having acomplementary metal-oxide-semiconductor (“CMOS”) device. Aninterconnection is provided between the passive electrical device andthe CMOS device.

In yet another exemplary embodiment, a method includes providing a firstsubstrate having a passive electrical device fabricated thereon andproviding a second substrate having a complementarymetal-oxide-semiconductor (“CMOS”) device. The method further includesproviding an interconnection to connect the passive electrical deviceand the CMOS device.

In another embodiment, a method includes integrating a stackedsemiconductor device into an electrical system. The device includesfirst and second substrates, and an interconnection therebetween. Thefirst substrate includes a passive electrical device fabricated thereon,and the second substrate includes a complementarymetal-oxide-semiconductor (“CMOS”) device. In some embodiments, theinterconnection is a conductive wafer boding interface orthrough-silicon-via (“TSV”).

In another embodiment, a stacked semiconductor device includes a firstsubstrate having one or more passive electrical devices fabricatedthereon, with no active devices fabricated thereon. In yet anotherembodiment, a method comprises providing a first substrate having apassive electrical device fabricated thereon, wherein there are noactive devices thereon, providing a second substrate having acomplementary metal-oxide-semiconductor (“CMOS”) device and providing aninterconnection to connect the passive electrical device and the CMOSdevice.

Another exemplary methodology of the present invention provides a methodto fabricate a stacked semiconductor device. The method includesproviding a first substrate having a first electrical device and a firstbond pad over the first electrical device, the first electrical devicebeing electrically connected to the first bond pad; providing a secondsubstrate having a second electrical device and a second bond pad overthe second electrical device, the second electrical device beingelectrically connected to the second bond pad; bonding the first andsecond substrates together, wherein the first and second bond pads areelectrically interconnected; and after the bonding, forming athrough-substrate-via (“TSV”) from a surface of the first substrateopposite the first bond pad, through the first substrate, and to thefirst bond pad.

Yet another exemplary methodology of the present invention provides amethod to fabricate a stacked semiconductor device. The method includesproviding a first substrate having a first electrical device and a firstbond pad over the first electrical device; depositing a first insulationlayer over the first bond pad over the first substrate; forming a firstrecess in the first insulation layer, the first recess having a bottomsurface lower than a bottom surface of the first bond pad; providing asecond substrate having a second electrical device and a second bond padover the second electrical device; depositing a second insulation layerover the second bond pad over the second substrate; forming a secondrecess in the second insulation layer to expose a portion of the secondbond pad; bonding the first insulation layer to the second insulationlayer with the first recess and the second recess aligned; and after thebonding, forming a through-substrate-via (“TSV”) from a surface of thefirst substrate opposite the first bond pad, through the first substrateto the first recess.

An exemplary embodiment of the present invention provides a stackedsemiconductor device. The stacked semiconductor device includes a firstsubstrate; a first bond pad over the first substrate; a second substrateincluding a second electrical device fabricated thereon; a second bondpad over the second electrical device over the second substrate, thesecond bond pad electrically connecting to the second electrical device;a second insulation layer over the second bond pad having a top surface,the second insulation layer being bonded toward the first bond pad ofthe first substrate; and a through-substrate-via (“TSV”) extending froma surface opposite to the first bond pad through the first substrate andthrough the top surface of the second insulation layer to the secondbond pad.

The foregoing outlines features of several embodiments so that thoseordinarily skilled in the art may better understand the aspects of thepresent disclosure. Those skilled persons should appreciate that theymay readily use the present disclosure as a basis for designing ormodifying other processes and structures for carrying out the samepurposes and/or achieving the same advantages of the embodimentsintroduced herein. Those ordinarily skilled in the art should alsorealize that such equivalent constructions do not depart from the spiritand scope of the present disclosure, and that they may make variouschanges, substitutions, and alterations herein without departing fromthe spirit and scope of the present disclosure. Therefore, it should beunderstood that the invention is not intended to be limited to theparticular forms disclosed. Rather, the intention is to cover allmodifications, equivalents, and alternatives falling within the spiritand scope of the invention as defined by the appended claims.

What is claimed is:
 1. A device comprising: a first semiconductorsubstrate having a first side and an opposing second side; a firstelectrical device embedded in the first semiconductor substrate adjacentthe first side of the semiconductor substrate; a first bonding paddisposed over the first side of the first semiconductor substrate,wherein the first bonding pad is electrically coupled to the firstelectrical device; a second semiconductor substrate having a third sideand an opposing fourth side; a second bonding pad disposed over thethird side of the second semiconductor substrate, wherein the first andsecond semiconductor substrates are bonded together via the firstbonding pad and the second bonding pad such that the first side of thefirst semiconductor substrate faces the third side of the secondsemiconductor substrate; and a through-substrate-via (“TSV”) extendingfrom the second side of the first semiconductor substrate to the firstbonding pad, wherein the TSV includes a trench extending from the secondside of the first semiconductor substrate to the first bonding pad and ametal material layer disposed within the trench.
 2. The device of claim1, further comprising a second electrical device embedded in the secondsemiconductor substrate adjacent the third side of the semiconductorsubstrate, wherein the second electrical device is electricallyconnected to the second bonding pad.
 3. The device of claim 2, whereinthe first electrical device includes a capacitor, and wherein the secondelectrical device includes a complementary metal-oxide-semiconductordevice.
 4. The device of claim 1, further comprising: a firstpassivation layer disposed over the first side of the firstsemiconductor substrate between the first bonding pad and the first sideof the first semiconductor substrate; and a second passivation layerdisposed over the third side of the second semiconductor substratebetween the second bonding pad and the third side of the secondsemiconductor substrate.
 5. The device of claim 4, wherein the firstpassivation layer physically contacts the second passivation layer. 6.The device of claim 4, wherein the first passivation layer does notphysically contact the second passivation layer.
 7. The device of claim4, wherein the first passivation layer includes a first interconnectstructure and the second passivation layer includes a secondinterconnect structure, and wherein the first and second interconnectstructures are electrically coupled.
 8. The device of claim 1, furthercomprising: an insulating layer disposed over the second side of thefirst semiconductor substrate; and a passivation layer disposed over theinsulating layer over the second side of the first semiconductorsubstrate.
 9. The device of claim 8, wherein the metal material layerdisposed within the trench includes opposing sidewall portions and thepassivation layer extends within the trench between the opposingsidewall portions of the metal material layer.
 10. A device comprising:a first semiconductor substrate having a first side and an opposingsecond side; a first bonding pad disposed over the first side of thefirst semiconductor substrate; a second semiconductor substrate having athird side and an opposing fourth side; a second bonding pad disposedover the third side of the second semiconductor substrate, wherein thefirst and second semiconductor substrates are bonded together such thatthe first side of the first semiconductor substrate faces the third sideof the second semiconductor substrate; and a through-substrate-via(“TSV”) extending from the second side of the first semiconductorsubstrate to the first bonding pad, wherein the TSV includes: a trenchextending from the second side of the first semiconductor substrate tothe first bonding pad; a conductive material disposed within the trenchand over the portion of the second side of the first semiconductorsubstrate, the conductive material disposed within the trench includingopposing sidewall portions; and a passivation layer disposed within thetrench and over the portion of the second side of the firstsemiconductor substrate, the passivation layer extending within thetrench between the opposing sidewall portions of the conductivematerial.
 11. The device of claim 10, wherein the TSV further includesan insulating material disposed within the trench and over a portion ofthe second side of the first semiconductor substrate.
 12. The device ofclaim 11, wherein the passivation layer is disposed over the insulatingmaterial on the second side of the first semiconductor substrate suchthat the passivation layer is prevented from interfacing with the firstsemiconductor substrate by the insulating material.
 13. The device ofclaim 10, further comprising a third bonding pad disposed over the firstside of the first semiconductor substrate; and a conductive bondingmaterial disposed over the third bonding pad, wherein the second bondingpad and the third bonding pad physically contact the conductive bondingmaterial.
 14. The device of claim 10, further comprising a firstinsulating layer disposed over the first side of the first semiconductorsubstrate between the first bonding pad and the first side of the firstsemiconductor substrate; and a second insulting layer disposed over thethird side of the second semiconductor substrate between the secondbonding pad and the third side of the second semiconductor substrate.15. The device of claim 14, wherein the first bonding pad is at leastpartially embedded within the first insulating layer.
 16. A devicecomprising: a first semiconductor substrate having a first side and anopposing second side; a first bonding pad disposed over the first sideof the first semiconductor substrate; a second semiconductor substratehaving a third side and an opposing fourth side; a second bonding paddisposed over the third side of the second semiconductor substrate,wherein the first and second semiconductor substrates are bondedtogether such that the first side of the first semiconductor substratefaces the third side of the second semiconductor substrate; and athrough-substrate-via (“TSV”) extending from the second side of thefirst semiconductor substrate to one of the first and second bondingpads, wherein the TSV includes: a trench extending from the second sideof the first semiconductor substrate to one of the first and secondbonding pads; a conductive material disposed within the trench and overthe portion of the second side of the first semiconductor substrate, theconductive material disposed within the trench including opposingsidewall portions; and a passivation layer disposed within the trenchand over the portion of the second side of the first semiconductorsubstrate, the passivation layer extending within the trench between theopposing sidewall portions of the conductive material.
 17. The device ofclaim 16, further comprising a first insulating layer disposed over thefirst side of the first semiconductor substrate such that at least aportion of the first bonding pad is embedded within the first insulatinglayer; and a second insulting layer disposed over the third side of thesecond semiconductor substrate between the second bonding pad and thethird side of the second semiconductor substrate.
 18. The device ofclaim 17, wherein the first bonding pad is part of a first interconnectstructure over the first side of the first semiconductor substrate. 19.The device of claim 17, wherein the passivation layer extends into thefirst insulating layer.
 20. The device of claim 17, wherein thepassivation layer extends into the first and second insulating layers.